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December 1998

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Subject:
From:
Larry Campbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Dec 1998 14:37:51 -0500
Content-Type:
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I've been asked the technical difference between a via and a plated
through hole.  We are dealing with through hole technology.  Should we
be specifying interfacial connections as one, or both of these types of
holes.  I have an old drawing that specifies interfacial connections shall
be IAW MIL-STD-275.  I know that spec has been replaced.  Like I said,
this is an old drawing.  We are currently using IPC-A-610 to inspect
assemblies and wonder if the note should be updated to reflect this
spec.  The only place I see the word "Interfacial Connection" used in the
spec is para.4.2.4 which is SMT vias, not component plated through
holes.  Maybe I should just remove the note, it almost seems redundant to
our assembly acceptance requirements.

Any comments or ideas?

Larry Campbell
BFGoodrich, Avionics Systems

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