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December 1998

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Subject:
From:
Barry Bates <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Dec 1998 09:22:52 -0000
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text/plain (74 lines)
amith,

I found an article by Stig Oresjo (Hewlett Packard manufacturing
test division USA) in "Future Circuits International" p. 235 date
and iss?? Title " Test Strategies for PCB Manufacturing". A very
informative intro. giving an overview of the topic of yields and
test and rework.
Hope you find it of some help.
Regards,
                Barry Bates



> -----Original Message-----
> From: amith k [SMTP:[log in to unmask]]
> Sent: 09 December 1998 09:34
> To:   [log in to unmask]
> Subject:      [TN] Assy : Rework / yield from the process
>
>                    *** WARNING ***
>
> This mail has originated outside your organization,
> either from an external partner or the Global Internet.
>      Keep this in mind if you answer this message.
>
>
> Hello Technetters,
>
> I am asking a basic question on assembly line.
>
> What percentage of rework (if any)one can expect from a normal
> SMT line, Through hole line, mixed assembly line ?
>
> What is the Test Yield(first shot) one can expect from the
> above lines ?
>
> Thanks in advance,
>
> amith
>
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