Sorry Sharon,
You sent this to the wrong Richard.
Rick Hudson.
[log in to unmask]
(602) 436-7154   (602) 436-7100 Fax





> -----Original Message-----
> From: Sharon Polmanteer [SMTP:[log in to unmask]]
> Sent: Thursday, December 10, 1998 9:46 AM
> To:   [log in to unmask]
> Subject:
>
> To Richard Haynes
>
> Hi Richard,
>
> We have been having intermittent trouble with (what most people call) pits
> in electrolytic Cu plating.  The location of these pits is always at the
> resist sidewall, they are always perfectly round, as are caused by
> bubbles.
> Popular opinion is that this has been caused by oxygen induction via
> filtration system.  All four of the copper tanks we have are different in
> physical construction and to have all the tanks cavitating air at one time
> seems an outside possibility to me.  However, we have asked for vendor
> guidance in new filtration system setup.
>
> Your comment on cathode-hydrogen evolution and oxygen evolution interested
> me and I have some questions:
>
> A vendor told me that there is no hydrogen evolution in acid copper as it
> is
> 100% efficient.  I don't know.
>
>  What physical characteristics do annodes exhibit when polizaration
> occurs?
> Is there extremely irregular surface?
>
> Can high chloride concentration also cause polizaration, i.e. 144 ppm?
>
> When I pull a sample in a glass flask and look at the amount of bubbles
> present, is turbidity the condition I'm looking for or the size/quantity
> of
> the bubbles present?  I don't know what amount of bubbles should cause
> concern.  Sorry if these are dumb questions.
>
> Thanks very much
> Sharon
>
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