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December 1998

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Subject:
From:
"James, Chris" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Dec 1998 11:59:01 -0000
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I am seeking information on the direct versus electroless metalisation
process used for the manufacture of via holes.

I would be interested to hear from anyone having done research on the
processes or has direct experience as a PCB end user.

As end users of PCB's ourselves we are hearing conflicting views on the
suitability of the direct plate process for high layer count (6 +) ,
high aspect ratio circuit boards. It is preferrably from end users of
such PCB's that I would most like to hear from regard the particular
direct plate system used in the manufacture of their boards, the
complexity of the board (aspect ratios, layer count etc), the end
environment their boards are used in and any reliability issues they may
have experienced.

Chris James
Engineering Services Manager
Dolby Labs Inc.
[log in to unmask]

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