Brett,

Please, start with your flex supplier, who hopefully was selected
because they've done COF before. There are a number to choose from these
days. IMHO ADFlex Solutions has about as much experience as anyone
you'll find, going back to a lot of early work with IBM and Smartflex.

The support of the flex you're bonding, the modulus of the adhesive
selected, the microstructure of the copper foil, and the plating quality
will all have an impact on your results.

Andy Magee
Flex Guru - Consulting
[log in to unmask]
(937) 435-3629

Does anyone have any wisdom they'd be willing to share on
implementing chip on flex?  We've been wire bonding (ball and
wedge) to alumina and LTCC substrates for years, and we're
thinking of trying a new prototype using a chip on flex approach,
where we would wire bond directly to gold traces on a flex circuit.
Any suggestions/ good or bad experiences, or know of any good
resources with info on this topic?

Thanks
Brett Goldstein
Mechanical Engineer
EVI, Inc.

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