Does anyone have any wisdom they'd be willing to share on
implementing chip on flex?  We've been wire bonding (ball and
wedge) to alumina and LTCC substrates for years, and we're
thinking of trying a new prototype using a chip on flex approach,
where we would wire bond directly to gold traces on a flex circuit.
Any suggestions/ good or bad experiences, or know of any good
resources with info on this topic?

Thanks
Brett Goldstein
Mechanical Engineer
EVI, Inc.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################