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December 1998

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Subject:
From:
Michael Forrester <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 9 Dec 1998 16:29:34 -0500
Content-Type:
text/plain
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text/plain (29 lines)
We are switching our surface mount boards from HASL to OSP.  The one
problem I see is there are several grounding areas ( .25" X 5" ) that have
metal bars mounted on both sides of the board attached via screws through
the bars and PCB.  There needs to be  good contact between the metal bars
and the grounding areas.  With a HASL board the is no oxidizing problem.
If I paste the area, I am concerned with the solder pooling toward the
center of the area and creating an uneven surface to mount the bars.  My
thought is to use vias on the grounding area to thieve the solder to
prevent solder pooling!  Has anyone tried this, and if so what size vias
were used, ratio of vias to surface area, etc..? Does anyone have any other
ideas?  Thank you.

Best Regards,

Mike Forrester
[log in to unmask]

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