TECHNET Archives

December 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
John Parsons <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 8 Dec 1998 09:28:22 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
Good Morning,

I am looking for process information on filling vias (12mil) using a
vertical HAL process for the purposed of heat dissipation.

Ideas, successes, failures - all replies welcome.

Regards

John Parsons
Circuit Graphics Ltd.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2