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December 1998

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Date:
Tue, 1 Dec 1998 08:57:44 -0600
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Werner,

I have no problem being included as "others," but it seems, for all us others, we are coming closer
together about this issue. I'm basing this on what you are now saying.

As far as not stating "evidence," I did provide sources for it so it may be obtained and used more
objectively. I never intended to be the source - just the messenger and long time user of the
source's/message's content. If you have other objective evidence, state or you will be guilty of
the same offense.

At least, I want to thank you for continuing a brave struggle and for admitting one very important
thing. If it don't solder the first time, why do it a second?

Something I am very curious about and, obviously, have little knowledge of, is HASL solder coating
thickness. I always was informed the process, because of the leveling characteristics no matter how
many times repeated, didn't add more thickness as the process kept it relatively inconsistent.

Also, I believe Afri should be more a part of this ongoing discussion. His original question was
what? I belive it had to do with multiple passes through HASL and what negative affects might be
encountered. I took this to mean not just solder wetting (at HASL) and effective solder joint
formation, but initial quality and long term reliability of boards and solder joints. Afri, where
are you?

There is so much more you have stated not originally addressed either in the original question or
your initial rebuttal. It all adds up to the need for a better understanding for/by all us
"others."

And on it goes?

Earl Moon

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