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December 1998

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Subject:
Solder side components
From:
Nick Nicolaides <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 22 Dec 1998 11:47:59 -0500
Content-Type:
text/plain
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text/plain (19 lines) 
Our CM (Contract Manufacturer) has requested larger pads then depicted in
IPC-782 on the solder side (bottome side) passiive components. In talks with
various consultants, there remarks were both the width and depth should be
enlarged over 782  to avoid solder skips.  The passive parts are
perpendicular to the wave and there is room for the 10 % enlargement. What
are your thoughts or experience.

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