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December 1998

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Subject:
Via Configuration
From:
Mike Bailey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 21 Dec 1998 07:29:27 -0500
Content-Type:
text/plain
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text/plain (18 lines) 
We continue to see current designs incorporating via hole configurations
utilizing "wagon wheel" interconnects to plane layers.  Didn't the
purpose of this design become obsolete unless thru-hole leaded components
and wave soldering are necessary? Why not simply go with direct connects?
 Can someone shed some light on this subject?

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