Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset=US-ASCII |
X-To: |
|
Date: |
Thu, 3 Dec 1998 14:33:13 -0600 |
Reply-To: |
|
Subject: |
|
From: |
|
Content-Transfer-Encoding: |
7bit |
Sender: |
|
Parts/Attachments: |
|
|
Dr. Warren,
I once worked for Hitachi in America/Japan for many years and have
been faced with translating many Janglish documents. By no means from
Japanese to English and vice versa, but once in English I helped the
translators use the appropriate wording for the specific technology.
Again, depending on the end application, the meaning could have a
multiude of definitions. For your request:
a. I am assuming they are making reference to high pin PBGA, Multi-I/O
BGA.
b. Another would be MCM PBGA (Multichip Module PBGA). MCMs are used
extensively with BGAs. Also try MCM-L PBGA (Multichip Module
Laminate FBGA).
Hope this helps.
John Gulley - Manager, Process QE
INET Technologies Inc
"A Smarter Vision"
______________________________ Reply Separator _________________________________
Subject: [TN] PBGA Word
Author: "Dr. Warren Smith" <[log in to unmask]> at Internet
Date: 12/3/98 2:38 PM
Another question from your friendly neighborhood Japanese translator.
Buildings with many stories are called "high-rise buildings." What are PBGAs
with a large number of layers called?
I am looking for the word you engineers use for something beyond merely
"multilayer PBGA," but something like a "many-layer PBGA" or a
"high-layer-count PBGA."
A web search for the word you folks use has not been useful.
If there are any Japanese folks in the crowd, the word I am trying to
translate is "Kou ta sou PBGA" (High-Many-Layer PBGA).
Thanks in advance!
Warren
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text
in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for
additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700
ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|