Hello, We are seeing huge nodules which occur mostly on the edges of
the pattern for our acid copper plating process. The copper in the
resist opening is of the normal height but near the edges it seem to be
about 30ums thicker. Another notable thing is that this happens when the
bath if very fresh i.e just after the anodes are filmed. Is this because
of a very high field in that region causing the copper to plate very
high. Any suggestions will be appreciated.
Yasmeen
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################