Hello,

I must purchase a new CAD (upper end midrange) system next year
(budget 10,000- 20,000 $, maybe higher). The system must be able to
handle microvias and should have some functionality for wire bonding.

I would like to know good/bad experiences about COB / microvia
designs with such systems especially  concerning ease of use with via
type selection during interactive routing, keeping design rules,
maybe depth of necessary workarounds, hidden costs for necessary
options etc.

The designs to be made with this system will be mostly MCM-L, 4-10
layes (signal and plane) overall, and 2-4 outer layers from that
number made with microvias in laser drill or photo etching technique
in sequential build up.

Thanks in advance, regards

-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://www.mansfeld-elektronik.de

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