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December 1998

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DesignerCouncil <[log in to unmask]>
Subject:
From:
"Dallara, Louis T (Louis)** CTR **" <[log in to unmask]>
Date:
Tue, 15 Dec 1998 09:53:47 -0500
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Ray Humphrey <[log in to unmask]>
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"DesignerCouncil E-Mail Forum." <[log in to unmask]>, "Dallara, Louis T (Louis)** CTR **" <[log in to unmask]>
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Good job Ray!
You did you Homework A+
Louis T. Dallara
Product Design Information (PDI) Group- Dept. 52R143000
LUCENT TECHNOLOGIES - MICROELECTRONICS GROUP
Optoelectronics Business Unit
Office: 2I-146E, 9999 Hamilton Blvd., Breinigsville, PA 18031
Telephone: 610-391-2145 FAX: 610-391-2142
e-mail: [log in to unmask]

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> ----------
> From:         Ray Humphrey[SMTP:[log in to unmask]]
> Reply To:     DesignerCouncil E-Mail Forum.;Ray Humphrey
> Sent:         Monday, December 14, 1998 6:43 PM
> To:   [log in to unmask]
> Subject:      Re: [DC] Plated Thru pads
>
> IPC-D-782 says, "Nonfunctional lands should be included on internal layers
> for all plated-through holes.  Nonfunctional lands need not be used where
> electrical clearance requirements do not permit, such as ground planes,
> voltage planes and thermal planes."
>
> Norman Einarson's Bare Board PWB Design Manual says, "Non-functional lands
> should be removed from inner layers, prior to the artworks being released
> for production.  These are the lands on inner layers where no circuit will
> be connected to any hole."  Further, its says, "During the lamination
> process, the epoxy in the pre-preg material will flow to the outer edges
> of
> the board.  This may cause the lands with no traces attached to float when
> the epoxy is flowing prior to cure."
>
> Summary - Talk to your own PCB vendor.
>
> -----Original Message-----
> From: KELLY M SCHRIVER <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Date: Monday, December 14, 1998 2:48 PM
> Subject: Re: [DC] Plated Thru pads
>
>
> >Scott -
> >
> >I think most of us are leaving all of the unused pads in place on plated
> thru
> >holes and vias, unless removal is necessary to increase routing density.
> >Leaving the pad stack intact adds just a bit of  uniformity and stability
> to
> >the hole.   With part of the pads gone, Z axis attachment of the barrel
> can
> >vary considerably.  This gets more important as the hole aspect ratio
> >increases.
> >
> >ITRI recently completed some testing dealing with allowable
> misregistration,
> >which strongly supports the stability theory.  This testing suggests that
> a
> >trace connecting directly to a barrel will survive IF a pad is present,
> even
> >though severely misregistered (giving a breakout condition).
> >
> >Regards - Kelly
> >
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