TECHNET Archives

November 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joe Dickson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 24 Nov 1998 10:11:32 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (36 lines)
Hello,
I am reviewing any system designed for cross sectioning vias less
than 8 mils in diameter.  We have all of the current systems (I
believe) including autogrind/alignment for mounting and are somewhat
successful, but it is very time consuming.
I'm looking for a system that will grind down to the center of the
via +/- .001".  Possibly an optical alignment for grinding and
locating of the via.  At the same time we will be upgrading our
microscope capability to view 500x on our video system.  I would like
to review a tooling system for a new microscope that would be
compatable with the alignment system.

If you know of a system or sell one please contact me.

Thank you,

Joe Dickson
Dir. of Engineering
Tyco Printed Circuits Group
400 Mathew St.
Santa Clara, Ca. 95050
408-727-9169
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2