Any information out there regarding immersion gold over nickel on SMT
printed wiring boards. This gives a very flat surface for fine pitch
placement. When I read in J-STD-001B in para.5.4.1 Gold Removal,  that "all"
surfaces to be soldered must have the gold removed, I am assuming that means
the gold pads also. Is this the intent? Does this preclude the use of
immersion gold over nickel is out? Being a MIL house there is concern with
gold embrittlement of the solder joints.
Barrie Candeas
GTE Taunton Ma.
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################