Fellow Technetters,

My company is experiencing a dewetting problem during assembly noted by
the following characterics:

a.  Doesn't occur across the entire lot of boards (random) being
processed.
b.  Occurs in select areas of the circuit and not on the entire board.

I'm trying to determine if this is assembly related before consulted the
board supplier.  What are the possible causes of this problem based on
the symptoms outlined above?  What are some possible corrective actions
I could take in-house to remedy this problem?  Given the symptoms, does
this sound like a board related issue?  Please advise.

Any and all feedback would be truly appreciated, and I would like to
thank all of you that participate in advance.

Best Regards

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