Gold plating is always quite tough on dry film, not only because pH issue,
but also more important H2 gas bubble generated during the plating. So you
can either try to make your resist more robust (some film stand better than
others, good surface and conformation, right amount UV exposure without
brittle the resist, developing the feature without undercut) or reduce Gold
plating damage on the resist ( Good vibration to sweep the bubble, Good
control of Au content 1 troy oz/gal something, people still plate at half
conc for cost saving. If it works Great, but need be aware the trade off,
Also tight control and adjust pH as need).  For pattern plating, you may
also need aware your circuit pattern and front to back issue.

Good luck and having fun.

-----Original Message-----
From: Francis Lai <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, November 06, 1998 4:38 PM
Subject: [TN] Problem in Gold Plating


>I work in gold plating. We are using electrolytic gold plating.
>
>It is pattern plating. However the gold leaks underneath the dry film.
>
>As a result the pattern is fatter after the dry film is removed.
>
>We develop the pattern dry film and thenn hardenn the dry film by
>
>exposing under UV light again. But still it leaks underneath the dry
>
>film. Could any one help ?
>
>WE also want to set up a pulse plating bath ourselves. Could any
>
>one give us some information onn how to start ?
>
>Thanks in advance!!!!!!!!
>
>my e-mail : [log in to unmask] ( Please do not send graphics, this
>                                        is text base)
>
>Thanks again
>
>Francis
>
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