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November 1998

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Subject:
From:
"Timothy A. Estes" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 6 Nov 1998 14:05:54 -0700
Content-Type:
text/plain
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text/plain (63 lines)
Hi Josh,

Why can't you make changes to the equipment?

We have found that how the etcher is "setup" can cause significant
variations in conductor widths.  Parameters such as spray pressures, nozzle
type, nozzle orientation, oscillation rate, and roller configuration affect
the uniformity of the finished conductor widths.

Please feel free to contact me if you have any questions.

Tim Estes
Conductor Analysis Technologies Inc.
Phone: 505-294-6936
Fax: 505-294-6596
Email: [log in to unmask]
Web: http://biz.swcp.com/cat


-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent:   Thursday, November 05, 1998 10:34 PM
To:     [log in to unmask]
Subject:        [TN] FAB: Cupric Chloride etching

I'm new at cupric etching.  What are the parameters for the average
innerlayer
etch line?  What controls should I be monitoring, for example, normality,
copper content, etc? What ranges will provide me the best process in terms
of
etch line quality (minimum copper foot with best possible line width
uniformity and etch speed)?  I know equipment has a lot to do with the
results; we can't change equipment, so I'm looking to improve quality with
chemistry.

Thanks.

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