I'm new at cupric etching.  What are the parameters for the average innerlayer
etch line?  What controls should I be monitoring, for example, normality,
copper content, etc? What ranges will provide me the best process in terms of
etch line quality (minimum copper foot with best possible line width
uniformity and etch speed)?  I know equipment has a lot to do with the
results; we can't change equipment, so I'm looking to improve quality with
chemistry.

Thanks.

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