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November 1998

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Subject:
Direct Bond Copper
From:
WM Cheng <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 4 Nov 1998 18:09:39 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 
     Dear Technetters,
     We are going to implement direct bond copper technique to our product,
     is there any guidelines or standard for the bonding technique,
     handling and assembly method available for reference?

     Thanks,
     WM Cheng

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