TECHNET Archives

November 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jim Gleason <[log in to unmask]>
Reply To:
Date:
Thu, 5 Nov 1998 16:22:00 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (61 lines)
There is a guy at a company called "Master Bond" named Dr. Brenner. He is
not a sales type and is pretty smart. Another good company is "cotronics
718-646-7996, but I don't know a contact.

----------
> From: glenn pelkey <[log in to unmask]>
> To: [log in to unmask]
> Subject: [TN] Backfill Recommendation
> Date: Thursday, November 05, 1998 11:51 AM
>
> Hello Technetters,
>
>      Like everyone else, we are in search of the perfect epoxy or
> similar material.  Our use is in backfilling a Nickle plated cavity,
> approximately 1.0 x 0.5 inches.  Unfortunately, results so far have
> shown poor adhesion to the Nickle and material shrinkage that has
> resulted in gaps at the interface.
>      We certainly don't want any trade secrets, but does anyone have a
> recommendation for solving this situation?  We've tried roughing up the
> surface for adhesion and a couple of low temperature cure epoxies with
> no luck.  We're now thinking about Silicones.
>      One other piece of this puzzel is the device must survive 1000
> temperature cycles between -40 and +85 C.
>
>      Thanks in advance for any input.
>
> Glenn Pelkey
> Maxtek Components Corp.
> Beaverton, OR
> (503) 627-2084
>
> ______________________________________________________
> Get Your Private, Free Email at http://www.hotmail.com
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
> ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2