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November 1998

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 2 Nov 1998 15:58:07 +1100
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text/plain (69 lines)
I just can't resist :

Ken some of my fabricating friends (hard to believe, I know) have been
(in my previous life, as Tom's say) at one time printing silk screen
almost 0.5mm high for similar reasons (covering via's below crystals)
If you stretch your local fabricating friends to limits on  viscosities
; you'll get your problems solved .
Otherwise ; get yourself one of those Bob's : Wave Soldering With Zero
Defects : book of thieves ;
that should help also :
http://www.bobwillis.co.uk
Email : [log in to unmask]

See you

Paul Klasek
http://www.resmed.com

> ----------
> From:         Ken Fong[SMTP:[log in to unmask]]
> Sent:         Tuesday, 3 November 1998 2:06
> To:   [log in to unmask]
> Subject:      [TN] solder resist between solder land to prevent solder
> bridging
>
>      Tehcnetters,
>
>      Could anyone advise the source of anything (solder resist,or
> other
>      chemicals,etc.,) that can be printed in between closely located
> solder
>      lands, such as those for SOIC or DIP packages, so that solder
> bridging
>      between these lands during wavesoldering can be prevented or
>      minimized?
>
>      Thanks for your help in advance.
>
>      Regards,
>      KenF, Nov 2,98
>
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