Hi Matt,
Your test with the parameters: 250 F, 2 hours, test hot is not adequate the
screen out latent defects that will become failures upon exposure to your
soldering processes—it should be as hot as your hottest soldering process.
You need to determine by cross-section whether you fractures in the copper of
the traces or if it is a separation at the barrel/trace interfaces.
In the former case, you used bad copper foil, and in the latter case the PCB
manufacturing process is at fault.
Without coupons you need to almost sacrifice one PCB per panel to be sure—but
it will really depend on the underlying cause of failure as determined by
determining the failure mode.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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