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November 1998

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Subject:
From:
Richard Haynes <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 4 Nov 1998 16:37:31 -0500
Content-Type:
text/plain
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text/plain (67 lines)
Francis,
With regards to your question 1: There are pulse plating cycles reported in
the SURFIN98 that claim improved physical properties and thickness
distributions in the PTH. Would you be interested?
Richard Haynes

-----Original Message-----
From: Francis Lai <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Saturday, October 31, 1998 10:31 AM
Subject: [TN] Copper plating & Copper thickness


>Dear Sir :
>
>I work inn a high frequency PCB manufacturing company and I have the
>
>following questionns :
>
>1/ Why is it for copper plating (acid copper plating) the lower the
>   current, the more the throwing power ? If I start to plate copper
>   on the PTH walls with high current density after PTH, what will
>   happen ?
>
>2/ Our customer always specify to have a certainn thickness innside the
>   PTH walls for copper. Why is that so for high frequency PCB ?
>   What happen if copper thickness is thinner than the specified
>   thickness at high frequencies ?
>
>Thanks for your help !!!!!!!
>
>my e-mail : [log in to unmask](this is only text base, pls do not
send
>                                      graphics)
>
>Thamks again!!!!!!!
>
>Francis
>
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