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November 1998

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Subject:
From:
"Mcmaster, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 4 Nov 1998 12:10:05 -0800
Content-Type:
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Using single-ply 1080 core (about 2.7 mils dielectric) with 0.5 oz/0.5
oz clad with single-ply 2113 prepreg, I can physically put 18 layers
into a 62 mil thick board (over the OL conductors) and 26 layers into a
93 mil thick board.  I've assumed half the layers will be signal layers.
You need to be willing to accept layer-to-layer dielectric thicknesses
of 2.5 mils, maybe even a little smaller.  There will likely be a number
of other issues related to producing such boards but the layers would
fit into the overall thicknesses requested.  It might even be possible
to add a few more layers by utilizing 2 mil Buried Capacitance core for
power/ground combinations and single-ply 1080 prepreg, but each of these
would involve special design considerations.
> ----------
> From:         Dennis Ward[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Dennis Ward
> Sent:         Wednesday, November 04, 1998 10:28 AM
> To:   [log in to unmask]
>
> Good afternoon,
>
> Quick question. What is the maximum amount of layers an
> ..062" thick boad can contain? What about .093" thick?
>
> Thanks
> Dennis Ward
> Net to Net Technologies
>
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