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November 1998

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Subject:
SOLDERMASK PLUGGED VIAS
From:
"Lolmaugh, Scott (AZ15)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 4 Nov 1998 11:29:31 -0700
Content-Type:
text/plain
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text/plain (27 lines) 
Is there an IPC specification for vias being intentionally filled and
plugged with liquid soldermask material (not dry film) for SMT boards, such
as...
level/percent of fill requirements
percent allowed less than preferred fill level
minimum acceptable fill level
etc., etc.
Thanks,
Scott Lolmaugh
Honeywell IAC, Inc.
Surface Mount & Advanced Manufacturing Technology
Production Engineering
602/313-3551 (voice)
602/313-3402 (FAX - Please call before sending)

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