we have just begun to evaluate Ultraplate for initial hole metalization on
thin FR4 applications. Preliminary testing is very encouraging with samples
for -40C / +125C thermal cycling about to begin 1000 hrs of testing.
Adhesion of the acid copper to the nickel looks good with no evidence of
voiding or pitting.

Regards.

-----Original Message-----
From:   Jac Kroeker [SMTP:[log in to unmask]]
Sent:   Monday, November 02, 1998 16:44 11:05
To:     [log in to unmask]
Subject:        [TN] electroless pth

I am having trouble posting this message to Technet. If you have seen this
before--- please excuse.

Hi platers and assemblers:
We would like to eliminate electroless copper from our pth line. Has
anybody had any experience with Fidelity's Ultraplate 300? Good, bad or
indifferent?
Are there other better alternatives? I am aware of paladium, but I don't
find it too exciting.
Jac from the great white north eh.

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