TECHNET Archives

November 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
solder resist between solder land to prevent solder bridging
From:
Ken Fong <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 2 Nov 1998 10:06:43 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
     Tehcnetters,

     Could anyone advise the source of anything (solder resist,or other
     chemicals,etc.,) that can be printed in between closely located solder
     lands, such as those for SOIC or DIP packages, so that solder bridging
     between these lands during wavesoldering can be prevented or
     minimized?

     Thanks for your help in advance.

     Regards,
     KenF, Nov 2,98

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2