I am having a cleaning problem.

We use a liquid, water soluble touch-up flux to assemble a module.  When the
module is complete we run it through an in-line cleaning system.

When the modules are inspected there is still yellow crusty residue left on
the module.  We have sent the modules out to a lab and their analysis shows
that the crusty residue is a form of tin oxide.

We beleive this tin oxide is not soluble and can not be cleaned with any
thing, and in order to eliminate this tin oxide residue we must eliminate
oxygen in the assembly process and use Nitrogen (N2).

Does this sound correct?

Is their anyone out there who could help steer me in the right direction?

Thanks for your help in advance!!

Kathy Palumbo

PS  Have a Happy and Safe Thanks Giving Holiday!!!

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