Thanks for the advice. Sort of like to find an alternate package style.
Putting an Epoxy dot may introduce expansion loads on the glass body during
temperature. The Zener will be used to burn-off flyback current coming back
up through the fet switch when the motor turns off. Is anyone familiar with
TAZ? Thanks in advance.

-----Original Message-----
From: Stephen R. Gregory [mailto:[log in to unmask]]
Sent: Wednesday, November 25, 1998 1:20 PM
To: [log in to unmask]
Subject: [TN] Subj: Re: [TN] SMT ZENER


In a message dated 11/25/98 1:08:58 PM Pacific Standard Time,
[log in to unmask] writes:

<< James and Gregory:
 The only problem with using SMD epoxy to hold the component in place
 during second reflow, is that you will need to qualify a material that
 meets the out-gassing requirements of TRW, and as James know they can be
 pretty stringent depending on the application.
  >>

Florencio,

     Seeing how you brought up something I wasn't aware of, do you know if
Loctite's 3611 (I mis-typed the formula before) meets that? It's a pretty
commonly used thermal cure epoxy for bottomside components...

-Steve Gregory-

P.S. Teach me something, what kinds of problems might be caused by
"outgassing" previously cured epoxy?

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