In a message dated 11/25/98 1:08:58 PM Pacific Standard Time,
[log in to unmask] writes:

<< James and Gregory:
 The only problem with using SMD epoxy to hold the component in place
 during second reflow, is that you will need to qualify a material that
 meets the out-gassing requirements of TRW, and as James know they can be
 pretty stringent depending on the application.
  >>

Florencio,

     Seeing how you brought up something I wasn't aware of, do you know if
Loctite's 3611 (I mis-typed the formula before) meets that? It's a pretty
commonly used thermal cure epoxy for bottomside components...

-Steve Gregory-

P.S. Teach me something, what kinds of problems might be caused by
"outgassing" previously cured epoxy?

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################