Afri,

If you've had no problems on other boards, determine this board's solderability. I mean, does it wet
adequately as a function of no contaminated (probably oxidized) areas elsewhere?

If you've had problems before, and who hasn't, determine your process management effectiveness.
Treat this process as one would the wave solder process. Determine flux composition and density.
Calibrate conveyor speed, solder temperature and dwell time, preheat and/or air knife temperatures,
solder purity/composition and, again, the board's solderability.

The last requirements is prime for all soldering operations and should be done on a sample level
basis using some type surface analysis technique. As you know, if excessive oxidation, or other
types, is apparent, solder wetting is not possible under any conditions without sacrificing
something else. As you also know, running the boards more than once starts to degrade their initial
quality and long term reliability. And on it goes.

Earl Moon

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