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Subject:	Re[2]: [TN] Intermittent Dewetting
From:	Mike Aldrich <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 3 Nov 1998 15:53:46 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (42 lines)

What do you recommend for thickness?  I've been in several discussions about this, but none have resulted in anything conclusive.  Also, how and where on surface mount pads do you measure this thickness?  Often people refer to the 'shininess' of the pads, but this seems to be more an issue of surface roughness/grain structure, and not particularly related to solderability.  Any comments?

Thanks,

Mike Aldrich


______________________________ Reply Separator _________________________________
Subject: Re: [TN] Intermittent Dewetting
Author:  MIME:[log in to unmask] at INTERNET
Date:    11/3/98 9:15 AM


Hi 'pacrim,'
Your problem is likely related for too thin HASL'ed solder layers for the transport/storage conditions experienced.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737 E-mail: [log in to unmask]

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