Joe Dickson wrote:
>
> Hello,
> I am reviewing any system designed for cross sectioning vias less
> than 8 mils in diameter.  We have all of the current systems (I
> believe) including autogrind/alignment for mounting and are somewhat
> successful, but it is very time consuming.
> I'm looking for a system that will grind down to the center of the
> via +/- .001".  Possibly an optical alignment for grinding and
> locating of the via.  At the same time we will be upgrading our
> microscope capability to view 500x on our video system.  I would like
> to review a tooling system for a new microscope that would be
> compatable with the alignment system.
>
> If you know of a system or sell one please contact me.
>
> Thank you,
>
> Joe Dickson
> Dir. of Engineering
> Tyco Printed Circuits Group
> 400 Mathew St.
> Santa Clara, Ca. 95050
> 408-727-9169
> [log in to unmask]
>
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Have you checked with Struers for the polishing / grinding equipment?
They are the best.

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