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November 1998

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Subject:
From:
Ryan Jennens <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 23 Nov 1998 13:01:53 -0500
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Howdy all-

        Three more days!
        When I asked our board fab house to mask the vias on the bottom side of one
of our boards to avoid the shorting which has been plaguing us, I was told
that they could do it, but for a cost of thousands of $.  They said that
they would have to make a clamshell fixture to test the bare board before
they ship it to us.  What are my other options for avoiding shorts to these
vias which are near pads.  This happens under BGA parts and also near some
surface mount parts.  Is tenting more than just covering the vias with
solder mask?  Thanks in advance for the wonderful insight which always
follows these inquiries!

Ryan Jennens
Phoenix Engineering Design, Inc.

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