Try an adhesive.dot and cure
     Al Cash
> ----------
> From:         Eric Christison[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Eric Christison
> Sent:         Monday, November 23, 1998 6:01 AM
> To:   [log in to unmask]
> Subject:      [TN] Accurately Positioning Components on PWBs
>
> We have a product in which we have to place an optical sensor on a PWB
> very accurately wrt a set of
> fixing holes for a lens.
>
> We have been reasonably successful in the past using BGA packaged devices.
> However, for reasons that
> are too boring to go into we have recently changed back to LCC packages.
> It seems that the position of
> LCC packaged device wanders a lot more during reflow than the BGA. Does
> anyone have any suggestions
> how the LCC can be fixed to the board during reflow to prevent it moving?
>
>
>
> Eric Christison
> Mechanical Engineer
> VLSI Vision Ltd
> Aviation House
> 31 Pinkhill
> Edinburgh
> EH12 7BF
>
> Tel:    +44 (0) 131 539 8165
> Fax:    +44 (0) 131 539 7141
>
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