In a message dated 11/23/98 2:57:52 AM Pacific Standard Time,
[log in to unmask] writes:

<< Hello techNetters,

 I am looking for the ideal temperature profile for curing the LOCTITE
 CHIPKLEBER 360.( i.e., to glue and cure after placing the chip
 components on the bottom side of the Printed circuit board, before the
 board goes for wave soldering )

 thanks in advance,

 amith>>

Amith,

      Chipbonder 360? One thing, if I'm not mistaken, that 360 sounds like
it's pretty old... I don't think loctite sells it anymore. But, I remember it
follows along the same cure profile as their 3609. Needs to see 150 degrees C.
for at least 90 seconds...2.5-3.5 minutes is ideal. I set 150 degrees C across
all my zones and let er' rip. The newer loctite formula (3611) has all the
same properties but cures even quicker.

-Steve Gregory-

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