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November 1998

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Subject:
Assembly : temp. profile for glue cure
From:
amith k <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 23 Nov 1998 02:42:54 PST
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text/plain
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Hello techNetters,

I am looking for the ideal temperature profile for curing the LOCTITE
CHIPKLEBER 360.( i.e., to glue and cure after placing the chip
components on the bottom side of the Printed circuit board, before the
board goes for wave soldering )

thanks in advance,

amith



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