Earl;
If you would be so kind to forward your paper to me regarding the study you
did on HASL fluxes would be greatly appreciated.
Fred Shubert
-----Original Message-----
From: [log in to unmask] <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, November 20, 1998 11:08 AM
Subject: Re: [TN] Tin/Lead Solder Coating Minimum Thickness Requirements
>Ah Eddie,
>
>Herein lies the rub. I have not reviewed current flux types used for HASL
processing. In times
>past, nearly all HASL fluxes were water soluble or RMA types (what else?).
I can only suggest you
>start with your current supplier and attempt determining their use, where
they purchase, what are
>the specs, and what else is available. Also, many "major," technically
astute fabrication
>capabilities know much more than the "average" job shop, and some can
discuss the matter more
>clearly than others.
>
>My apologies for not being more current, but I am somewhat anti-HASL (as
you may have gathered).
>Therefore, I have been constantly searcing for the "perfect" alternative.
>
>I can say that most board shops, in which I consult, no little of assembly
processes - let alone
>soldering principles. This ignorance increases (not being negative - just
providing observations as
>fab suppliers make boards - don't they?) concerning fluxes, flux
composition and application
>requirements, conveyor speeds, thermal deltas, solder temperatures and
dwell times, etc. I've just
>described major sub-processes in the wave solder process, haven't I?
>
>I certainly appreciate your concern and positive attitude concerning such a
vital issue. Because of
>this, I will begin again looking into the matter more. Also, I have an old
article I published if
>your are interested. It is a rather large Jpeg file and will take about 20
minutes to transfer. I
>mention this because I do not wish to "clog" your computer plumbing.
>
>Enjoy,
>
>Earl Moon
>
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