Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 20 Nov 1998 08:00:15 -0700 |
Content-Type: | multipart/mixed |
Parts/Attachments: |
|
|
Steve
If you put to much thought into the eraser bit, you will drive your self crazy. Let me enlighten you what could happen using an eraser. Taking a silicone and rubbing 99.99% soft Au bond leads will remove stains but as well remove the 30-50 micro inches of Au exposing Ni. Silicone is an organic and in essence, you are spreading organics all across the Au surface. I have wire bonded to erased Au, with exposed Ni and had good bond pull XBAR (high teens) and low sigma (<.75).
Try the other stuff first in my first message but then try eraser as a last resort. Just do it and do it gently. Do not erase Au like you would erase pencil lead.
Good Luck!!
Best Regards,
David Jandzinski
Substrate Product Engineer
Abpac, Inc
-----Original Message-----
From: Russell Spivey [SMTP:[log in to unmask]]
Sent: Friday, November 20, 1998 2:31 AM
To: [log in to unmask]
Subject: Re: [TN] Gold Finger Stains
Steve,
Try a standard white rubber (UK speak) or eraser (USA speak). Just a light
rub should polish up the gold.
I have used it in the past quite effectively for tarnish & surface
contaminants on gold finish.
I have not done any analysis as to the effects of using this method but I am
sure some of our colleagues out there will put us right if they figure out
any detrimental effects.
Regards,
Russell Spivey
> -----Original Message-----
> From: Joy, Stephen C [SMTP:[log in to unmask]]
> Sent: Thursday, November 19, 1998 6:38 PM
> To: [log in to unmask]
> Subject: [TN] Gold Finger Stains
>
> Can anyone tell me how to rework water spots or stains on gold fingers?
>
> There are not that many, so there is no point to do rel testing to
> validate
> it
> is OK, but I don't want to just ship them to cutomers.
>
> All help appreciated.
>
> Steve
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|