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Subject:	Re: Tin/Lead Solder Coating Minimum Thickness Requirements
From:	[log in to unmask]
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 20 Nov 1998 09:55:37 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (39 lines)

Ah Eddie,

Herein lies the rub. I have not reviewed current flux types used for HASL processing. In times
past, nearly all HASL fluxes were water soluble or RMA types (what else?). I can only suggest you
start with your current supplier and attempt determining their use, where they purchase, what are
the specs, and what else is available. Also, many "major," technically astute fabrication
capabilities know much more than the "average" job shop, and some can discuss the matter more
clearly than others.

My apologies for not being more current, but I am somewhat anti-HASL (as you may have gathered).
Therefore, I have been constantly searcing for the "perfect" alternative.

I can say that most board shops, in which I consult, no little of assembly processes - let alone
soldering principles. This ignorance increases (not being negative - just providing observations as
fab suppliers make boards - don't they?) concerning fluxes, flux composition and application
requirements, conveyor speeds, thermal deltas, solder temperatures and dwell times, etc. I've just
described major sub-processes in the wave solder process, haven't I?

I certainly appreciate your concern and positive attitude concerning such a vital issue. Because of
this, I will begin again looking into the matter more. Also, I have an old article I published if
your are interested. It is a rather large Jpeg file and will take about 20 minutes to transfer. I
mention this because I do not wish to "clog" your computer plumbing.

Enjoy,

Earl Moon

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