TECHNET Archives

November 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Tin/Lead Solder Coating Minimum Thickness Requirements
From:
Rob Horsley <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 20 Nov 1998 14:57:54 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines) 
Larry

Page 157 of  'Mechanics of Solder Alloys - Wetting and Spreading' by DR
Frear, FG Yost and FM Hosking gives reported CuSn intermetallic growth
rates, at room temperature, of 0.3, 0.5 and a maximum of 0.8 microns per
year.

Regards

Rob

Manufacturing Technology
Celestica Limited
UK

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2