Earl,
Do you know of any moves within the industry to look at fluxes for HASL and
how they affect long term reliability?
Can you comment on the level of bromides or level of activity of the fluxes
used. We are fairly familiar with the nature of fluxes for assembly, but I
don't recall any debates regarding the fluxes for fabrication. Is it
possible to get you guys discussing this on this forum? I appreciate you
giving us the info. about Cu oxidation after rinse/microetch. Can we have
anymore?


Regards


>
>Many suppliers do not understand fluxes or how to determine their
>capability. Many do not understand thermal shock/stress, solder
>temperature requirements, dwell times, and contact areas. All have
>problems with excess Cu oxidation after rinse/microetch - before
>introduction to a process not always capable of removing such
>oxidation preventing wetting to be effected. Many more do not
>provide adequate training for personnel attempting to manage an
>often unmanageable process - and on it goes.
>

>Earl Moon
>
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