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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 20 Nov 1998 09:28:16 -0000 |
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Michael,
A colleague has given me a ref
Developments in Paassive Thermal Management Systems for
Electronics
S. Hamilton
Circuit World Vol 14 Number 1
In the UK, TECAN Components Ltd have lots of info
http://www.tecan.co.uk
Hope this helps.
Barry Bates.
> -----Original Message-----
> From: Hiteshew, Michael [SMTP:[log in to unmask]]
> Sent: 19 November 1998 21:40
> To: [log in to unmask]
> Subject: [TN] Heat Sinks on PWBs
>
> *** WARNING ***
>
> This mail has originated outside your organization,
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> Keep this in mind if you answer this message.
>
>
> Hey Guys,
> Can anyone direct to me to any technical papers (or
> books) comparing
> various methods of heat sinking PWBs. I'm looking for
> information that
> compares cost, thermal efficiency, mechanical strength, etc.
> Even papers
> that addressed only a single method (no comparison) would be of
> value.
> Specifically, the options we're considering are:
>
> A) Nickel plated copper laminated to the primary component
> side.
>
> B) Aluminum plate bonded to the secondary side with thermally
> conductive and
> compliant glue.
>
> C) Copper-invar-copper core material.
>
> Thanks for your help.
>
> Michael Hiteshew
> Lockheed Martin Launching Systems
> [log in to unmask]
> (410) 682-1259
>
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