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November 1998

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Subject:
From:
Barry Bates <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 20 Nov 1998 09:28:16 -0000
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Michael,
A colleague has given me a ref

Developments in Paassive Thermal Management Systems for
Electronics
S. Hamilton
Circuit World Vol 14 Number 1

In the UK, TECAN Components Ltd have lots of info
http://www.tecan.co.uk

Hope this helps.
Barry Bates.

> -----Original Message-----
> From: Hiteshew, Michael [SMTP:[log in to unmask]]
> Sent: 19 November 1998 21:40
> To:   [log in to unmask]
> Subject:      [TN] Heat Sinks on PWBs
>
>                    *** WARNING ***
>
> This mail has originated outside your organization,
> either from an external partner or the Global Internet.
>      Keep this in mind if you answer this message.
>
>
> Hey Guys,
>         Can anyone direct to me to any technical papers (or
> books) comparing
> various methods of heat sinking PWBs. I'm looking for
> information that
> compares cost, thermal efficiency, mechanical strength, etc.
> Even papers
> that addressed only a single method (no comparison) would be of
> value.
> Specifically, the options we're considering are:
>
> A) Nickel plated copper laminated to the primary component
> side.
>
> B) Aluminum plate bonded to the secondary side with thermally
> conductive and
> compliant glue.
>
> C) Copper-invar-copper core material.
>
> Thanks for your help.
>
>  Michael Hiteshew
>  Lockheed Martin Launching Systems
>  [log in to unmask]
>  (410) 682-1259
>
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