The easiest way would be to alternate sides , 1 ground plane to front 1
circuit side to front. until tank filled , with an even number of
panels.
        Best way with non split rectification is to relocate 1 anode
form circuit side to ground plain side and run at a slightly lower
current density, If you currently run at 30 ASF then try 20, increase
the time to maintain similar amp minutes to allow comparable thickness
as 30 ASF to be achieved

Russell Smith
 ----------
From: Francis Lai
To: [log in to unmask]
Subject: [TN] Pattern Copper Plating
Date: Sunday, November 15, 1998 10:52PM

1/ Our acid copper plating bath has only one power supply. The front and

   back anodes are connected to one terminal and the cathode is
connected

   to the other terminal. There are 3 front anodes and 3 back anodes.

2/ We have to do a pattern plating. The front side is about 3/5 of the
area

   of the back to be plated. We want to plate about 350 u in. of copper.

   The fronnt side has a 3 mil line and tolerance is +/- 0.5 mil.

   The back is the ground plane pattern.

4/ Could anyone advise how can we do it with the conditions given?

my e-mail : [log in to unmask]

Thanks a lot in advance!!!!!!!

Francis

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