Hi John,
In a message dated 11/17/98 12:56:44, you wrote:
>Does anyone have practical experience of the effects of thermal expansion
>mismatch on a thermally conductive glueline between a silicon die (in our
>case, Motorola MPC740 BGA Power PC processor) and an aluminium heatsink?
>
>We have looked at several adhesives, some of which are much more compliant
>than others, and are looking for criteria on which to base the final
decision.

The answer to your question is: It depends (not meant to be funny).
The higher the power dissipation, the more temp cycling (testing?), the larger
the silicon die, the more compliant your die attach needs to be.
What are you electrically connecting these die to?

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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