Back in the "good old days"  (1980 something) there was a company named Signetics. Who are
they now? Anyway, they tin/lead plated and reflowed all component leads. What incredible
solderability!

Life was good. Then came tin immersion, oxidation, poor solderability, and unacceptable solder
joints. Oh the stories I could tell and the pictures that could be shown. NCR hide your face
in shame.

Again, history repeats. What's the term - Dejavu (how is it spelled?) all over again.

Solder solders to solder when the right stuff comes together in a process managed capability
(heat, flux, speed, and all that stuff). Of course, there must be little oxidation. That's why
tin/lead plating is good but great when reflowed - but the bumps caused all the other problems
as a surface not acceptable to surface mount technology and environmental issues - or is there
a way?
Earl Moon

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