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November 1998

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From:
"(No Name Available)" <[log in to unmask]>
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TechNet E-Mail Forum.
Date:
Tue, 17 Nov 1998 10:09:07 -0500
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     electroless nickel plating on aluminum using a double zincate process
     is available from ATOTech USA, Inc.  It is a standard process and has
     been in use for quite some time in various other industries.

     Try calling Larry Loerch, 908.302.3529


     Michael Holan
     Process Engineer
     HADCO-Austin
     512-246-5600


______________________________ Reply Separator _________________________________
Subject: [TN] AW: [TN] Electroless Nickel for Aluminum
Author:  =?iso-8859-1?Q?N=FCchter_Wolfgang_=28FV/FLT=29_=2A?=
<[log in to unmask]> at SMTPLink-Hadco
Date:    11/17/98 4:07 PM


Hi Mike,
As far as I know, you have to do a zincate treatment to get a good adhesion
between Al and Ni.
This process is not yet really a standard process available on the market,
but will be in the near future.
My purpose is to have an an wetable surface for solder in the case of
flip-chip. So try to contact Flip-Chip Technologies, IZM Berlin, Germany,
IBM, Motorola, IC Interconnect, ...
Hope this points you to the right direction.

Regards
        Wolfgang Nuechter

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